A fracture mechanics approach to thermal fatigue life prediction of solder joints
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 15 (4) , 559-570
- https://doi.org/10.1109/33.159886
Abstract
No abstract availableThis publication has 44 references indexed in Scilit:
- Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal CyclingJournal of Electronic Packaging, 1992
- Superplastic Creep of Eutectic Tin-Lead Solder JointsJournal of Electronic Packaging, 1991
- A Nonlinear and Time Dependent Finite Element Analysis of Solder Joints in Surface Mounted Components Under Thermal CyclingMRS Proceedings, 1991
- Fracture behavior of 63sn-37pb solderEngineering Fracture Mechanics, 1990
- Determination of Stress Intensity Factors for Interfacial Cracks in Bimaterial SystemsJournal of Electronic Packaging, 1990
- Nucleation and growth of cavities at defined grain boundaries in bicrystalsScripta Metallurgica et Materialia, 1990
- Research on the Mechanism of Thermal Fatigue in Near‐eutectic Pb‐Sn SoldersSoldering & Surface Mount Technology, 1989
- Elastic/plastic fracture analysis for bonded jointsEngineering Fracture Mechanics, 1987
- Pb-Sn Alloy Microstructure: Potential Reliability Indicator for InterconnectsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Hold-time effects in high temperature fatigueActa Metallurgica, 1978