Cost, Performance, and Size Tradeoffs for Different Levels in a Memory Hierarchy*

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Abstract
Until recently, electronically addressable devices such as ferrite core, plated wire, semiconductor memories, and electromechanically addressable devices such as magnetic tapes, disks, and drums were the few technologies from which a computer system designer could build a memory system. A number of different new technologies and devices have been developed that close the "access gap"14between the two dissimilar technologies mentioned above. These include charge-coupled devices (CCD's),2bubble memories,4electron beam addressed memories (EBAM),17and domain tip propagation (DOT).16Other technologies like CMOS1and integrated injection logic (I2L),9compete directly with the existing technologies. Table 1 (see p. 46) shows the possibility of a six-level hierarchy and some cost and performance projections for these technologies.

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