Thermal wake models for forced air cooling of electronic components
- 30 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Liquid crystal imaging for temperature measurement of electronic devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Substrate conduction mechanisms in convectively cooled simulated electronic packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002