Fundamental aspects of pulsating current metal electrodeposition II: The mechanism of metal film formation on an inert electrode
- 31 August 1980
- journal article
- Published by Elsevier in Surface Technology
- Vol. 11 (2) , 111-116
- https://doi.org/10.1016/0376-4583(80)90025-4
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Fundamental aspects of pulsating current metal electrodeposition I: The effect of the pulsating current on the surface roughness and the porosity of metal depositsSurface Technology, 1980
- The mechanism of formation of a surface film of silver on a platinum electrode in galvanostatic depositionJournal of Applied Electrochemistry, 1978
- Electrocrystallization in pulse electrolysisSurface Technology, 1978
- The mechanism of formation of a surface film of silver on a platinum electrodeJournal of Applied Electrochemistry, 1976
- The relationship between the effective current density and the effective overpotential in copper deposition by the pulsating potentialJournal of Applied Electrochemistry, 1974