Technologies for rapid prototyping of multi-chip modules

10 December 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 588-592
https://doi.org/10.1109/iccd.1991.139980

Abstract

Component technologies are described to be used in the maskless customization of multi-chip modules (MCMs) including: laser processes for linking and cutting conductors; an interconnect net routing tool; and MCM assembly, test, and electrical characterization methods. Each component technology was successfully demonstrated through independent tests. The first integrated demonstration of these technologies is the customization of a three-chip MCM centered around a Motorola 88100-based chip set.

Keywords

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