A lapping and polishing process to achieve high quality alumina surfaces for applications in device fabrication
- 1 November 1992
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 220 (1-2) , 222-226
- https://doi.org/10.1016/0040-6090(92)90576-w
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Thin film interconnect processesThin Solid Films, 1991
- Electrical detection of end point in polishing process of thin-film heads (invited)Journal of Applied Physics, 1987
- SiO2 planarization technology with biasing and electron cyclotron resonance plasma deposition for submicron interconnectionsJournal of Vacuum Science & Technology B, 1986
- Considerations for polishing glassy carbon to a scratch-free finishAnalytical Chemistry, 1985