Thin film interconnect processes
- 1 December 1991
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 206 (1-2) , 70-75
- https://doi.org/10.1016/0040-6090(91)90395-e
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Ion-implant-enhanced reflow of phosphosilicate glass filmsThin Solid Films, 1989
- Selective Low Pressure Chemical Vapor Deposition of TungstenJournal of the Electrochemical Society, 1984
- Plasma anodization of silicon at room temperatureRevue de Physique Appliquée, 1981