Intermetallic growth on PWBs soldered with Sn3.8Ag0.7Cu
- 25 June 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
M , 0.85T m and 0.9T m for 10, 100 and 1000 hours. The following board plating systems were investigated: organic solderability preservative (OSP) over bare copper, immersion tin, immersion silver, and immersion gold over electroless nickel. This st udy revealed that the composition, microstructure, and thicknessKeywords
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