Flip-chip bonded 0.85-μm bottom-emitting vertical-cavity laser array on an AlGaAs substrate
- 1 September 1996
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Photonics Technology Letters
- Vol. 8 (9) , 1115-1117
- https://doi.org/10.1109/68.531807
Abstract
We report high-performance 0.85-/spl mu/m bottom-emitting vertical-cavity surface-emitting lasers (VCSELs) on an AlGaAs substrate with 2.1 mA threshold current density 4.2 mW maximum output power, 11.7% power conversion efficiency and a maximum operating temperature of 130/spl deg/C. We also demonstrate a flip-chip bonded 0.85-/spl mu/m bottom-emitting VCSEL array, and confirm all pixels across the 8/spl times/8 VCSEL array operate at a f/sub 3/ dB bandwidth of 2.6 GHz at only 4.2 mA.Keywords
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