Microstructural evolution during thermomechanical fatigue of 62Sn-36Pb-2Ag and 60Sn-40Pb solder joints
- 1 January 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (4) , 718-726
- https://doi.org/10.1109/33.62585
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
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- A microstructural study of the thermal fatigue failures of 60sn-40Pb solder jointsJournal of Electronic Materials, 1988
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- The Reflow Attachment and Reliability Testing of Ceramic Chip CarriersPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1981