Insulation and passivation of three-dimensional substrates by plasma-CVD thin films using silicon-organic compounds
- 1 July 1991
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 139, 380-384
- https://doi.org/10.1016/0921-5093(91)90646-5
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Gas evolution studies for structural characterization of hexamethyldisilazane-based a-Si:C:N:H filmsJournal of Applied Physics, 1987
- Plasma-assisted chemical vapor deposition processes and their semiconductor applicationsThin Solid Films, 1984
- Correlation of chemical and electrical properties of plasma-deposited tetramethylsilane filmsJournal of Applied Physics, 1981