Correlation of chemical and electrical properties of plasma-deposited tetramethylsilane films
- 1 February 1981
- journal article
- conference paper
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 52 (2) , 903-908
- https://doi.org/10.1063/1.328774
Abstract
Thin films of tetramethylsilane (TMS) were formed using rf-glow-discharge polymerization. The films were found to be pinhole free, chemically resistant, and adherent to silicon, aluminum, and glass substrates. Electron microprobe analyses and IR Fourier transform spectroscopy (FTS) demonstrated that small concentrations of oxygen (2–6 at. %) were always incorporated into the polymer structure. Film density, refractive index, and dielectric constant were correlated with the chemical composition of the films. Capacitance-voltage studies of metal-polymer-silicon structures indicated that charge trapping and polarization instabilities existed in the films, and FTS suggests that these charge effects originated at SiO and C = 0 sites. The polymer films were found to be sensitive to moisture and to oxygen. Electron transport was enhanced in films which were exposed to water vapor.This publication has 16 references indexed in Scilit:
- Films from the Low Temperature Oxidation of SilaneJournal of the Electrochemical Society, 1979
- Conduction mechanism in plasma-polymerized tetrafluoroethylene filmsJournal of Applied Physics, 1978
- Advances in deposition processes for passivation filmsJournal of Vacuum Science and Technology, 1977
- Charge transport in thin polymer films as shown by CV measurementsThin Solid Films, 1977
- A Model for the Kinetics of Plasma PolymerizationMacromolecules, 1977
- Electrical properties of metal-polymer (polysiloxane)-silicon structures and application of polysiloxane to the passivation of semiconductor devicesThin Solid Films, 1976
- Thin-film adhesionJournal of Vacuum Science and Technology, 1974
- Organosilicon Films Formed by an RF Plasma Polymerization ProcessJournal of the Electrochemical Society, 1972
- Encapsulation of integrated circuitsProceedings of the IEEE, 1969
- A New Technique for the Study of Electronic Transport in InsulatorsJournal of Applied Physics, 1968