Hydrogenation of GaN, AlN, and InN

Abstract
Hydrogen incorporation depths of ≥1 μm are measured for 2H plasma exposure of GaN and AlN at 250–400 °C for 30 min. The concentration of 2H incorporated is in the range 5–10×1017 cm−3 for GaN and 5–30×1018 cm−3 for AlN under these conditions. No redistribution of the hydrogen is observed for annealing temperatures up to 800 °C, but at 900 °C there is substantial loss of hydrogen from the samples. Similar results are obtained for 2H implantation into GaN, AlN, and InN, with no significant redistribution observed up to 500–600 °C in either AlN or InN, and motion only at 900 °C in GaN. The thermal stability of hydrogen in III‐V nitrides explains previous results for Mg‐doped GaN grown using NH3, where post‐growth annealing at high temperatures was required to achieve appreciable doping efficiencies.

This publication has 18 references indexed in Scilit: