Effects of Thickness and Oxygen Content on Thermomechanical Behavior of Thin Cu Films Passivated with Ain
- 1 January 1999
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivationJournal of Materials Research, 1998
- Thermal strain and stress in copper thin filmsThin Solid Films, 1995