Thermal strain and stress in copper thin films
Open Access
- 1 June 1995
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 262 (1-2) , 142-153
- https://doi.org/10.1016/0040-6090(95)05834-6
Abstract
No abstract availableKeywords
This publication has 16 references indexed in Scilit:
- Stress development and relaxation in copper films during thermal cyclingJournal of Materials Research, 1993
- Effect of surface diffusion on the creep of thin films and sintered arrays of particlesActa Metallurgica et Materialia, 1993
- The yield stress of polycrystalline thin filmsJournal of Materials Research, 1993
- Texture evolution during grain growth in polycrystalline filmsScripta Metallurgica et Materialia, 1993
- Effects of grain orientation on hillock formation and grain growth in aluminum films on silicon substratesScripta Metallurgica et Materialia, 1992
- Separation of film thickness and grain boundary strengthening effects in Al thin films on SiJournal of Materials Research, 1992
- Measurement and interpretation of stress in copper films as a function of thermal historyJournal of Materials Research, 1991
- Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniquesJournal of Materials Research, 1986
- Hall-petch relation in thin film metallizationsScripta Metallurgica, 1986
- Thermal strain in lead thin films I: Dependence of the strain on crystal orientationThin Solid Films, 1977