Reliability of Interconnects Exhibiting Bimodal Electromigrationinduced Failure Distributions
- 1 January 1992
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Abnormal grain growth in aluminum alloy thin filmsJournal of Applied Physics, 1991
- Electromigration-induced failures in interconnects with bimodal grain size distributionsJournal of Electronic Materials, 1990
- A new electromigration testing technique for rapid statistical evaluation of interconnect technologyIEEE Electron Device Letters, 1986
- ELECTROMIGRATION IN SINGLE-CRYSTAL ALUMINUM FILMSApplied Physics Letters, 1970