Microcircuit Accelerated Testing Using High Temperature Operating Tests
- 1 October 1975
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Reliability
- Vol. R-24 (4) , 238-250
- https://doi.org/10.1109/TR.1975.5215180
Abstract
The general validity and effectiveness of accelerated tests of microcircuits using both temperature and voltage as accelerating stresses has been demonstrated. However, the inherent effectiveness of the accelerated tests can only be assured through careful selection of the life-test circuit-configuration, and test temperatures, and the effective analysis of the resulting failure data. Careful selection of the accelerating electrical and thermal stresses is essential for maximum acceleration of use-condition failure-mechanisms without introducing damaging or unrealistic failure modes. Effective mathematical analysis of the test data is necessary to ensure an accurate determination of use-condition failure-rates. A discussion of the techniques utilized to conduct microcircuit accelerated life testing and a detailed description of a recent microcircuit accelerated test study program conducted under contract to the Rome Air Development Center are presented.Keywords
This publication has 5 references indexed in Scilit:
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- Thermally accelerated aging of semiconductor componentsProceedings of the IEEE, 1974
- Materials for High Temperature Integrated Circuit Testing8th Reliability Physics Symposium, 1971
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- Failure Mechanisms and Device ReliabilityFourth Annual Symposium on the Physics of Failure in Electronics, 1967