Roles of Ti-intermetallic compound layers on the electromigration resistance of Al-Cu interconnecting stripes
- 15 June 1992
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 71 (12) , 5877-5887
- https://doi.org/10.1063/1.350485
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
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