The effect of anodization on the electromigration drift velocity in aluminum films
- 15 September 1989
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 66 (6) , 2349-2355
- https://doi.org/10.1063/1.344266
Abstract
The electromigration drift velocity has been measured, using the Blech–Kinsbron [Thin Solid Films 25, 327 (1975)] edge displacement method, for aluminum thin films under different thicknesses of anodization. The drift velocity is found to decrease with increasing anodization thickness. The results are interpreted in terms of a change in the self-diffusivity of aluminum as a result of the compressive stresses imposed by the anodized layer. The effect of the variation of diffusivity with stress on the stress distribution within a drifting thin-film sample is discussed.This publication has 13 references indexed in Scilit:
- A model for electromigration behaviour in terms of flux divergencesScripta Metallurgica, 1987
- Activation energy for electromigration failure in Al–Cu conductor stripes covered with polyimideJournal of Applied Physics, 1986
- The effect of passivation thickness on the electromigration lifetime of Al/Cu thin film conductorsJournal of Vacuum Science & Technology A, 1983
- The role of metal and passivation defects in electromigration-induced damage in thin film conductorsThin Solid Films, 1982
- High Rate Thick Film GrowthAnnual Review of Materials Science, 1977
- Measurement of stress gradients generated by electromigrationApplied Physics Letters, 1977
- Stress generation by electromigrationApplied Physics Letters, 1976
- Electromigration in thin aluminum films on titanium nitrideJournal of Applied Physics, 1976
- Electromigration in thin gold films on molybdenum surfacesThin Solid Films, 1975
- Coating, Mechanical Constraints, and Pressure Effects on ElectromigrationApplied Physics Letters, 1972