Coating, Mechanical Constraints, and Pressure Effects on Electromigration
- 15 February 1972
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 20 (4) , 173-174
- https://doi.org/10.1063/1.1654097
Abstract
The effect of the mechanical constraints exerted by coatings upon electromigration in thin films is evaluated on the basis of known pressure effects upon diffusion.Keywords
This publication has 9 references indexed in Scilit:
- Low-Loss Image for Surface Scanning Electron MicroscopeApplied Physics Letters, 1971
- Nuclear-Magnetic-Resonance Determination of the Activation Volume for Self-Diffusion in AluminumPhysical Review B, 1971
- ELECTROMIGRATION-INDUCED FAILURES IN ALUMINUM FILM CONDUCTORSApplied Physics Letters, 1970
- Electromigration Damage in Aluminum Film ConductorsJournal of Applied Physics, 1970
- ELECTROMIGRATION IN SINGLE-CRYSTAL ALUMINUM FILMSApplied Physics Letters, 1970
- The effects of dielectric overcoating on electromigration in aluminum interconnectionsIEEE Transactions on Electron Devices, 1969
- Electromigration—A brief survey and some recent resultsIEEE Transactions on Electron Devices, 1969
- Current-induced mass transport in aluminumJournal of Physics and Chemistry of Solids, 1964
- Pressure Effect on Vacancy Migration Rate in GoldPhysical Review B, 1961