A non-dimensional correlation for the external thermal characteristics of surface mount metal quad flat packs
- 17 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Development of a cost effective high performance metal QFP packaging systemPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Thermal enhancement of surface mount electronic packages with heat sinksPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Heat Transfer in Electronic PackagesPublished by Springer Nature ,1989
- A comprehensive correlating equation for laminar, assisting, forced and free convectionAIChE Journal, 1977
- A general expression for the correlation of rates of transfer and other phenomenaAIChE Journal, 1972