An ellipsometric investigation of reaction rate oscillations during the electrochemical anodization of Cu in H3PO4 solutions: Some preliminary results
- 31 December 1987
- journal article
- Published by Elsevier in Surface Science
- Vol. 191 (1-2) , 225-238
- https://doi.org/10.1016/s0039-6028(87)81058-0
Abstract
No abstract availableKeywords
This publication has 18 references indexed in Scilit:
- Self-Oscillations of Heterogeneous Catalytic Reaction RatesCatalysis Reviews, 1978
- Oscillations in Catalytic ReactionsCatalysis Reviews, 1977
- Further studies on periodic phenomena in passivating systemsJournal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1969
- The influence of solution flow on anodic polishing. Copper in aqueous o-phosphoric acidElectrochimica Acta, 1964
- Anodic Behavior of Copper in Phosphoric AcidJournal of the Electrochemical Society, 1961
- The Nature of the Film Formed on Copper during ElectropolishingJournal of the Electrochemical Society, 1956
- The Mechanism of Electropolishing of Copper in Phosphoric Acid SolutionsJournal of the Electrochemical Society, 1953
- The Mechanism of Electropoiishing of Copper in Phosphoric Acid SolutionsJournal of the Electrochemical Society, 1953
- Electrolytic Polishing. IIJournal of Applied Physics, 1940
- Electrolytic PolishingJournal of Applied Physics, 1939