Epoxy encapsulation on Ceramic Quad Flat Packs
- 17 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Encapsulants used in flip-chip packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Flip-chip encapsulation on ceramic substratesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Encapsulant for fatigue life enhancement of controlled collapse chip connection (C4)Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- UV curable urethane encapsulant for ceramic chip carriersPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002