Flip-chip encapsulation on ceramic substrates
- 30 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 175-181
- https://doi.org/10.1109/ectc.1993.346835
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Enhancement of flip-chip fatigue life by encapsulationIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991
- Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed BoardsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Cost/Performance Single-Chip ModuleIBM Journal of Research and Development, 1982