Thermal analysis of photoresists in aid of lithographic process development
- 1 February 1997
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 35 (1-4) , 141-144
- https://doi.org/10.1016/s0167-9317(96)00174-8
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Wet silylation and oxygen plasma development of photoresists: A mature and versatile lithographic process for microelectronics and microfabricationJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1996
- Thermal and mechanical analysis of photoresist and silylated photoresist films: Application to AZ 5214™Microelectronic Engineering, 1996
- An advanced epoxy novolac resist for fast high-resolution electron-beam lithographyJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1995
- Towards a better understanding of positive chemically amplified systems.Journal of Photopolymer Science and Technology, 1995