Chemical additives for improved copper chemical vapour deposition processing
- 1 June 1995
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 262 (1-2) , 46-51
- https://doi.org/10.1016/0040-6090(94)05808-3
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Chemical vapor deposition of copper from Cu+1 precursors in the presence of water vaporApplied Physics Letters, 1993
- Role of solvents in chemical vapor deposition: implications for copper thin-film growthThe Journal of Physical Chemistry, 1993
- Mechanistic studies of copper thin-film growth from CuI and CuII .beta.-diketonatesJournal of the American Chemical Society, 1993