No-clean And Water-clean Mass Reflow Processes Of 0.4 mm Pitch, 256-Pin Fine Pitch Quad Flat Packs (QFP)
- 24 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 305-315
- https://doi.org/10.1109/iemt.1992.639909
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- Low solids flux technology for solder assembly of circuit packsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Analytical and Experimental Studies of 208‐pin Fine Pitch (0·5 mm) Quad Flat Pack Solder‐joint ReliabilityCircuit World, 1992
- An Introduction to Tape Automated Bonding TechnologyPublished by Springer Nature ,1991
- Solder Joint ReliabilityPublished by Springer Nature ,1991
- Cleaning Printed Wiring Assemblies in Today’s EnvironmentPublished by Springer Nature ,1991
- Overview of Tape Automated Bonding TechnologyCircuit World, 1990
- Solder Paste in Electronics PackagingPublished by Springer Nature ,1989
- Geometric Optimization of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969
- SLT Device Metallurgy and its Monolithic ExtensionIBM Journal of Research and Development, 1969