An Introduction to Tape Automated Bonding Technology

This publication has 67 references indexed in Scilit:

• High-Frequency Performance of TAB
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
• Acoustic-Emission-Monitored Tests for TAB Inner Lead Bond Quality
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1982
• Do flame retardants affect the reliability of molded plastic packages?
  Microelectronics Reliability, 1981
• Different Chip Interconnecting Techniques
  Active and Passive Electronic Components, 1980
• The Role of Hybrids in LSI Systems
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1979
• Quantitative Auger analysis of gold-copper-oxygen and gold-nickel-oxygen surfaces using relative sensitivity factors
  Surface Science, 1977
• Interdiffusion in the CuAu thin film system at 25°C to 250°C
  Thin Solid Films, 1977
• A formalism for determining grain boundary diffusion coefficients using surface analysis
  Surface Science, 1976
• Strength of Gold-Plated Copper Leads on Thin Film Circuits Under Accelerated Aging
  IEEE Transactions on Parts, Hybrids, and Packaging, 1975
• Analysis and Development of a Thermocompression Bond Schedule for Beam Lead Devices
  IEEE Transactions on Parts, Hybrids, and Packaging, 1972