Acoustic-Emission-Monitored Tests for TAB Inner Lead Bond Quality
- 1 December 1982
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 5 (4) , 445-453
- https://doi.org/10.1109/tchmt.1982.1135998
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
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- Reliability Improvement of Wire Bonds Subjected to Fatigue Stresses8th Reliability Physics Symposium, 1972
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