The Use of Acoustic Emission in a Test for Beam-Lead, TAB, and Hybrid Chip Capacitor Bond Integrity
- 1 June 1977
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 13 (2) , 116-127
- https://doi.org/10.1109/tphp.1977.1135184
Abstract
No abstract availableKeywords
This publication has 11 references indexed in Scilit:
- Kinetics of Thermocompression Bonding to Organic Contaminated Gold SurfacesIEEE Transactions on Parts, Hybrids, and Packaging, 1977
- Failure Modes of Beam-Lead Semiconductors in Thin-Film Hybrid MicrocircuitsIEEE Transactions on Parts, Hybrids, and Packaging, 1976
- Moisture, Myths, and MicrocircuitsIEEE Transactions on Parts, Hybrids, and Packaging, 1976
- The Mechanics of Gold Beam Leads During Thermocompression BondingIEEE Transactions on Parts, Hybrids, and Packaging, 1976
- Encapsulation of Integrated Circuits Containing Beam Leaded Devices with a Silicone RTV DispersionIEEE Transactions on Parts, Hybrids, and Packaging, 1976
- Effect of Surface Contamination on the Thermocompression Bondability of GoldIEEE Transactions on Parts, Hybrids, and Packaging, 1975
- On Chemical Cleaning for Thermocompression BondingIEEE Transactions on Parts, Hybrids, and Packaging, 1975
- Real Time Detection of Microcracks in Brittle Materials Using Stress Wave Emission (SWE)IEEE Transactions on Parts, Hybrids, and Packaging, 1974
- Analysis and Development of a Thermocompression Bond Schedule for Beam Lead DevicesIEEE Transactions on Parts, Hybrids, and Packaging, 1972
- Erkenntnisse und Folgerungen aus der Messung von Geräuschen bei Zugbeanspruchung von metallischen WerkstoffenArchiv für das Eisenhüttenwesen, 1953