Kinetics of Thermocompression Bonding to Organic Contaminated Gold Surfaces
- 1 June 1977
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 13 (2) , 132-137
- https://doi.org/10.1109/tphp.1977.1135191
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- The High Temperature Deformation Properties of Gold and Thermocompression BondingIEEE Transactions on Parts, Hybrids, and Packaging, 1975
- Effect of Surface Contamination on the Thermocompression Bondability of GoldIEEE Transactions on Parts, Hybrids, and Packaging, 1975
- Grain boundary self-diffusion in evaporated Au films at low temperaturesThin Solid Films, 1974
- Thermally Activated Deformation of Gold Single CrystalsMetallurgical Transactions, 1973
- Studies of Bonding Mechanisms and Failure Modes in Thermocompression Bonds of Gold Plated Leads to Ti-Au Metallized Substrates8th Reliability Physics Symposium, 1971
- Self-diffusion in goldJournal of Physics and Chemistry of Solids, 1965