Do flame retardants affect the reliability of molded plastic packages?
- 1 January 1981
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 21 (4) , 533-541
- https://doi.org/10.1016/0026-2714(81)90244-4
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Investigation of the molecular processes controlling corrosion failure mechanisms in plastic encapsulated semiconductor devicesMicroelectronics Reliability, 1981
- Application of thermal analysisJournal of Electronic Materials, 1977
- A Two Hour Porosity Test for Gold on Substrates of Copper, Silver and NickelTransactions of the IMF, 1972