Activation energies of intermetallic growth of Sn-Ag eutectic solder on copper substrates

This publication has 10 references indexed in Scilit:

• Significantly improved mechanical properties in Pb-free, Sn-Zn-In solder alloy by Ag doping
  Applied Physics Letters, 1994
• Microstructure evolution of eutectic Sn-Ag solder joints
  Journal of Electronic Materials, 1994
• Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys
  Metallurgical and Materials Transactions A, 1994
• New Pb-free solder alloy with superior mechanical properties
  Applied Physics Letters, 1993
• The formation and growth of intermetallics in composite solder
  Journal of Electronic Materials, 1993
• Developing lead-free solders: A challenge and opportunity
  JOM, 1993
• The properties of tin-bismuth alloy solders
  JOM, 1993
• Converting to lead-free solders: An automotive industry perspective
  JOM, 1993
• The dependence of the activation energies of intermetallic formation on the composition of composite Sn/Pb solders
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,1993
• Thermal Fatigue in Solder Joints
  JOM, 1988