Alloy decomposition and surface instabilities in thin films
- 15 February 1998
- journal article
- research article
- Published by American Physical Society (APS) in Physical Review B
- Vol. 57 (8) , 4805-4815
- https://doi.org/10.1103/physrevb.57.4805
Abstract
We show that in the presence of substrate misfit and compositional stresses, static or growing films that undergo surface spinodal decomposition are always unstable to perturbations around the planar surface. For sufficiently rapid deposition processes, the planar surface can be stabilized due to a suppression of the alloy decomposition. Films grown outside of the miscibility gap can become unstable due to the mismatch with the substrate and compositionally generated stresses. We also demonstrate that the instability is independent of the sign of the misfit when the elastic moduli of the alloy constituents are equal, and the existence of a maximum misfit above which the film is always unstable, even at high growth rates. The symmetry under sign reversal of the misfit can be broken by composition-dependent elastic constants.Keywords
This publication has 16 references indexed in Scilit:
- Elastic effects and phase segregation during the growth of thin alloy layers by molecular-beam epitaxyPhysical Review B, 1997
- Chemical ordering during surface growthPhysical Review B, 1997
- Molecular beam epitaxy in the presence of phase separationPhysical Review B, 1997
- Stress-Driven Alloy Decomposition during Step-Flow GrowthPhysical Review Letters, 1996
- Morphological Stability of Alloy Thin FilmsPhysical Review Letters, 1995
- Direct imaging of surface cusp evolution during strained-layer epitaxy and implications for strain relaxationPhysical Review Letters, 1993
- Morphological instability in epitaxially strained dislocation-free solid filmsPhysical Review Letters, 1991
- Effect of strain on surface morphology in highly strained InGaAs filmsPhysical Review Letters, 1991
- On the stability of surfaces of stressed solidsActa Metallurgica, 1989
- Interface morphology development during stress corrosion cracking: Part I. Via surface diffusionMetallurgical Transactions, 1972