Characterization of mechanical and thermal properties of thin Cu foils and wires

This publication has 12 references indexed in Scilit:

• The ‘size effect’ on the stress–strain, fatigue and fracture properties of thin metallic foils
  Materials Science and Engineering: A, 2001
• Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers
  Acta Materialia, 2000
• Ein schnell messendes Laser-Speckle-Extensometer zur Bestimmung von statischen und dynamischen Materialparametern
  e+i Elektrotechnik und Informationstechnik, 2000
• Noncontacting strain measurements at high temperatures by the digital laser speckle technique
  Experimental Mechanics, 2000
• Plasticity at the micron scale
  International Journal of Solids and Structures, 2000
• Thermal and mechanical properties of micromaterials using laser-optical strain sensors
  Published by SPIE-Intl Soc Optical Eng ,1999
• Size effects in materials due to microstructural and dimensional constraints: a comparative review
  Acta Materialia, 1998
• Microstructural development during fatigue of copper foils 20–100 μm thick
  Materials Science and Engineering: A, 1994
• Correlation of analytical and experimental approaches to determine thermally induced PWB warpage
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1993
• Mechanical properties of thin films
  Metallurgical Transactions A, 1989