High flux boiling applied to microelectronics thermal control
- 1 July 1988
- journal article
- Published by Elsevier in International Communications in Heat and Mass Transfer
- Vol. 15 (4) , 509-531
- https://doi.org/10.1016/0735-1933(88)90045-0
Abstract
No abstract availableKeywords
This publication has 11 references indexed in Scilit:
- Natural Convection Heat Transfer Characteristics of Simulated Microelectronic ChipsJournal of Heat Transfer, 1987
- Bibliography of Heat Transfer in Electronic EquipmentIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985
- Computers in Science and Technology: Early IndicationsScience, 1984
- Conduction Cooling for an LSI Package: A One-Dimensional ApproachIBM Journal of Research and Development, 1982
- High-performance heat sinking for VLSIIEEE Electron Device Letters, 1981
- Preparation and Performance of Dendritic Heat SinksJournal of the Electrochemical Society, 1974
- Hydrodynamic Prediction of Peak Pool-boiling Heat Fluxes from Finite BodiesJournal of Heat Transfer, 1973
- Liquid immersion cooling of small electronic devicesMicroelectronics Reliability, 1973
- Liquid cooling of microelectronic devices by free and forced convectionMicroelectronics Reliability, 1972
- Photographic Study of Nucleate Pool Boiling on a Horizontal SurfaceJournal of Heat Transfer, 1965