Tensile Testing Of Epitaxial Silicon Films
- 25 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 2, 96-99
- https://doi.org/10.1109/sensor.1995.721753
Abstract
Tensile tests have been performed, successfully, on epitaxial silicon film specimens that were fabricated with anisotropic etching. During the test, the force and elongation are measured for the calculation of an apparent Young's mod ulus. The apparent modulus was small compared to published data, but modeling has attributed this difference to elongation of the fixation glue.Keywords
This publication has 6 references indexed in Scilit:
- Mechanical Characterization of Thin Films by Micromechanical TechniquesMRS Bulletin, 1992
- Micromechanical fracture strength of siliconJournal of Applied Physics, 1990
- Residual stress and mechanical properties of boron-doped p+-silicon filmsSensors and Actuators A: Physical, 1990
- Fracture testing of silicon microelements i n s i t u in a scanning electron microscopeJournal of Applied Physics, 1988
- Young's Modulus, Shear Modulus, and Poisson's Ratio in Silicon and GermaniumJournal of Applied Physics, 1965
- Deformation and fracture of small silicon crystalsActa Metallurgica, 1957