Comparison of electromigration phenomenon between aluminum interconnection of various multilayered materials

Publisher Website

13 January 2003

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

https://doi.org/10.1109/vmic.1989.78040

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

Effective kinetic variations with stress duration for multilayered metallizations
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003
Effects of annealing temperature on electromigration performance of multilayer metallization systems
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003