Effective kinetic variations with stress duration for multilayered metallizations

This publication has 8 references indexed in Scilit:

• Effects of annealing temperature on electromigration performance of multilayer metallization systems
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003
• Electromigration and low-frequency resistance fluctuations in aluminum thin-film interconnections
  IEEE Transactions on Electron Devices, 1987
• Electromigration Testing of Ti/Al-Si Metallization for Integrated Circuits
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,1987
• 1fNoise and Grain-Boundary Diffusion in Aluminum and Aluminum Alloys
  Physical Review Letters, 1985
• Electromigration-Induced Short Circuit Failure
  8th Reliability Physics Symposium, 1985
• A new method for detecting electromigration failure in VLSI metallization
  IEEE Journal of Solid-State Circuits, 1984
• Activation energies for the different electromigration mechanisms in aluminum
  Solid-State Electronics, 1981
• Electromigration testing of Ti: W/Al and Ti: W/Al-Cu film conductors
  Thin Solid Films, 1978