Stereological properties of the intermetallic formed at the nickel-liquid tin interface
- 31 January 1996
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 205 (1-2) , 209-213
- https://doi.org/10.1016/0921-5093(95)09870-4
Abstract
No abstract availableKeywords
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- Parameters affecting thermal fatigue behavior of 60Sn-40Pb solder jointsJournal of Electronic Materials, 1989
- The Ni−Sn (Nickel-Tin) systemBulletin of Alloy Phase Diagrams, 1985