Parameters affecting thermal fatigue behavior of 60Sn-40Pb solder joints
- 1 November 1989
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 18 (6) , 671-680
- https://doi.org/10.1007/bf02657518
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
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