Fatigue of 60/40 Solder
- 1 December 1986
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 9 (4) , 423-432
- https://doi.org/10.1109/tchmt.1986.1136672
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
- Solder Fatigue Problems in Power PackagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Grain-boundary diffusion in some Pb-Sn alloysJournal of Applied Physics, 1982
- Fatigue at High Temperature-Prediction and InterpretationProceedings of the Institution of Mechanical Engineers, 1974
- Frequency dependent low cycle fatigue crack propagationMetallurgical Transactions, 1973
- Fatigue at High TemperaturePublished by ASTM International ,1973
- Fatigue: A complex subject—Some simple approximationsExperimental Mechanics, 1965