Crack initiation and growth during low cycle fatigue of Pb-Sn solder joints
- 9 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Effect of composition on the low-cycle fatigue of Pb alloy solder jointsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Microstructural Observations and Mechanical Behavior of Pb-Sn Solder on Copper PlatesMRS Proceedings, 1986
- A Critical Analysis of Crack Propagation LawsJournal of Basic Engineering, 1963