Effect of composition on the low-cycle fatigue of Pb alloy solder joints
- 4 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 496-504
- https://doi.org/10.1109/ectc.1990.122234
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
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- Effects of R-ratio and wave form on the fatigue of 63Sn-37Pb solder used in electronic packagingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1988
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- A Model of High-Cycle Fatigue-Crack Initiation at Grain Boundaries by Persistent Slip BandsPublished by Springer Nature ,1983
- An Investigation of Fatigue Life Performance in Lap-Type Solder JointsPublished by ASTM International ,1972