Pb - Sn Solder for Die Bonding of Silicon Chips
- 1 June 1986
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 9 (2) , 190-194
- https://doi.org/10.1109/tchmt.1986.1136634
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Properties of Die Bond Alloys Relating to Thermal FatigueIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1979
- Thermal Fatigue Failure of Soft-Soldered Contacts to Silicon Power TransistorsIEEE Transactions on Parts, Hybrids, and Packaging, 1977
- Reliability and thermal impedance studies in soft soldered power transistorsIEEE Transactions on Electron Devices, 1976