Properties of Die Bond Alloys Relating to Thermal Fatigue
- 1 June 1979
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 2 (2) , 257-263
- https://doi.org/10.1109/tchmt.1979.1135450
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- Reliability and thermal impedance studies in soft soldered power transistorsIEEE Transactions on Electron Devices, 1976
- Stresses and strains in a plate bonded to a substrate: Semiconductor devicesSolid-State Electronics, 1971
- Thermal fatigue in silicon power transistorsIEEE Transactions on Electron Devices, 1970
- Lead and Lead AlloysPublished by Springer Nature ,1970
- Reliability of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969
- Geometric Optimization of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969
- Thermal Stress and Low Cycle FatigueJournal of Applied Mechanics, 1966
- Thermal stress and fracture in shear-constrained semiconductor device structuresIRE Transactions on Electron Devices, 1962
- Thermally-induced cracking in the fabrication of semiconductor devicesIRE Transactions on Electron Devices, 1959
- Analysis of Bi-Metal ThermostatsJournal of the Optical Society of America, 1925