Stresses and strains in a plate bonded to a substrate: Semiconductor devices
- 31 October 1971
- journal article
- Published by Elsevier in Solid-State Electronics
- Vol. 14 (10) , 1035-1039
- https://doi.org/10.1016/0038-1101(71)90172-9
Abstract
No abstract availableThis publication has 8 references indexed in Scilit:
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- Stresses in Epitaxially Grown Single-Crystal Films: YIG on YAGJournal of Applied Physics, 1970
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- Thermally Induced Strains in Evaporated FilmsJournal of Applied Physics, 1965
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- Thermally-induced cracking in the fabrication of semiconductor devicesIRE Transactions on Electron Devices, 1959
- Determination of Thermal Stresses in Three-Ply LaminatesJournal of Applied Mechanics, 1955
- Thermal Stresses in a Rectangular Plate Clamped Along an EdgeJournal of Applied Mechanics, 1949