Thermal Modeling of Plastic Ic Packages
- 1 January 1991
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Silicon interconnect-a critical factor in device thermal managementPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Shear Stress Evaluation of Plastic PackagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Stress-Induced Deformation of Aluminum Metallization in Plastic Molded Semiconductor DevicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985
- The Quality of Die-Attachment and Its Relationship to Stresses and Vertical Die-CrackingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983