Dynamic mechanical properties of polyimide/poly(silsesquioxane)‐like hybrid films
- 12 June 2001
- journal article
- research article
- Published by Wiley in Journal of Applied Polymer Science
- Vol. 81 (10) , 2500-2516
- https://doi.org/10.1002/app.1692
Abstract
No abstract availableKeywords
This publication has 20 references indexed in Scilit:
- Low dielectric polyimide/poly(silsesquioxane)-like nanocomposite materialPolymer, 2001
- Chemical Mechanical Polishing of Low‐Dielectric‐Constant Polymers: Hydrogen Silsesquioxane and Methyl SilsesquioxaneJournal of the Electrochemical Society, 1999
- Chemical-mechanical polishing of low dielectric constant poly(silsesquioxane): HSQJournal of Polymer Research, 1999
- Effects of morphology and surface characteristics of poly(imide siloxane)s and deep UV/O3 surface treatment on the interfacial adhesion of poly(imide siloxane)/alloy-42 leadframe jointsJournal of Polymer Research, 1999
- Adhesion behavior of PDMS-containing polyimide to glassJournal of Adhesion Science and Technology, 1998
- Polymeric Organic−Inorganic Hybrid Nanocomposites: Preparation of Polyimide-Modified Poly(silsesquioxane) Using Functionalized Poly(amic acid alkyl ester) PrecursorsMacromolecules, 1997
- Crosslinked networks based on trimethoxysilyl functionalized poly(amic ethyl ester) chain extendable oligomersPolymer, 1997
- Water Resistance of Poly(Imide-Siloxane) Adhesives: Diffusion Coefficients by Gravimetric SorptionThe Journal of Adhesion, 1994
- Synthesis, characterization, and properties of photosensitive silicon‐containing copolyimidesJournal of Applied Polymer Science, 1990
- PolyimidesPublished by Springer Nature ,1984