Reliability and failure analyses of thermally cycled ball grid array assemblies
- 27 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 713-720
- https://doi.org/10.1109/ectc.1998.678777
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- Ball grid array reliability assessment for aerospace applicationsMicroelectronics Reliability, 1999